A rilru a buai em em a, a rilru a hah em em bawk a. Multilayer Graphite Film (MGF) .

Product chungchang tlangpui

Multilayer Graphite Film (MGF) hi graphene sheet stacking technology hmanga siam chhuah, thermal management material flexible tak a ni. Natural graphite emaw polyimide (PI) atanga siam niin, high-temperature graphitization, precision calendaring, leh composite forming process hmanga siam a ni. Material hi graphene sheet layer tam tak, structure mumal taka dah, van der Waals force hmanga inzawmkhawm a ni. MGF hian graphene thermal leh electrical conductivity sang tak chu a vawng reng a, a layered structure erawh chuan mechanical strength leh processing performance a ti tha zawk thung. Electronics, new energy, aerospace, leh high{5}}tech industry dangteah pawh heat concentration, cooling efficiency hniam, leh electromagnetic interference ang chi harsatna tlangpui hmachhawn turin hman a ni nasa hle.

Technical Parameter hrang hrang te

Parameter Hming a ni	Hlawm khat	Typical Value a ni
Thickness a ni	μm	25–300
-plane ah chuan Thermal Conductivity a awm a	W/m·K	1000–1600
Sakhal zawng	g/cm3 a ni	0.8–1.2
Surface Resistance a ni	mΩ/sq a ni	<100
Operating Temperature Range a ni	degree	-40–400
Thickness Tolerance a ni	-	±5%
Tensile chakna a nei	MPa	50 aia tam emaw, a tlukpui emaw

Core Performance Characteristics te chu a hnuaia mi ang hian a ni

MGF-a layered structure danglam tak hian high-end application-a industry mamawh phuhruk thei performance nghet leh rintlak a pe a ni. A thatna ber chu:

Thermal Conductivity sang tak a niMGF hian in-plane thermal conductivity 1000 atanga 1600 W/m·K thleng a pe a, hei hi traditional metal, copper leh aluminum aiin a sang zawk hle. Electronic component atanga lumna a hip lut nghal vat a, a sem darh nghal vat a, hotspots a tihtlem bakah hun rei tak-term operation nghet tak neih theih nan a pui bawk.

EMI Shielding tha tak a niSurface resistivity hniam tak neiin MGF hian electromagnetic shielding rintlak tak a pe a ni. Electronic part sensitive tak takte chu pawn lam atanga inthlak danglamna lakah a venghim a, component hrang hrang inkara signal tihbuai a veng a, electronic device hmasawn takah electromagnetic compatibility tha zawk a support bawk.

Chemical leh Thermal Stability chak tak a niCarbon-based material thianghlim a nih angin MGF hian temperature sang leh hniam hnuaiah a thawk tha hle a, corrosion leh oxidation do theihna tha tak a lantir bawk. Humid, acidic, or alkaline environment-ah pawh a stable reng a, end products tan service life rei zawk a support a ni.

Flexibility leh Processability tha tak a niMGF hi a rit lo va, a flexible bawk a, bending, folding, leh die-cutting te a phalsak a ni. Design curved emaw irregular emaw nena inmil turin size leh thickness hrang hrangah siam theih a ni a, hei hian product structure hrang hrangah a inzawm khawm awlsam hle.

A rit lo leh Ultra-Thin Profile a niMetal material nena khaikhin chuan MGF hian density a nei hniam zawk a, controllable thickness a nei bawk. Product design rit lo tak a support a, internal space tlemteah a fit a, hei vang hian electronic device te tak te leh portable tan pawh a tha hle.

Dilna Field hrang hrang

MGF hian thermal conductivity nasa tak a nei a, a flexible a, a light a, ultra-thin a ni a, electromagnetic shielding tha tak a nei bawk. Chuvangin high{2}}end industry tam takah- electronics, new energy, leh aerospace-ah te hman a ni nasa hle. Industry tinte thermal management leh electromagnetic compatibility mamawh nen a inmil hle a, a hman tak tak dan chu hetiang hi a ni:

High-end Electronics lam a ni

Precision electronic device chi hrang hrang tana key heat dissipation material a ni a, heat piling up leh tight installation space ang chi harsatna te chu a tifel thei a ni. Smartphone, tablet leh laptop-a CPU, GPU leh battery module atan kan hmang ber a; smart wearables-a part tenau tak tak, watch leh bracelets te; leh network hmanrua server leh router ang chi core chip te pawh a awm bawk. Tin, electromagnetic shielding a neih avangin electronic device signal te chu a nghet reng a, interference pawh a titawp bawk.

Energy thar a ni

Energy power hmanrua thara thermal management tha tak neihna atana hman kan tum ber a ni. Energy thar lirthei battery pack, motor leh electronic control system-ah hman a ni ber-a hman laiin hmanrua atanga lumna tam tak a la chhuak nghal thei a, battery a lum lutuk leh a chhe lutuk loh nan a titawp thei a, battery chu a rei zawk a, hman a him zawk bawk. Photovoltaic inverter leh energy storage hmanrua-a heat dissipation module-ah te pawh a thawk a, boruak khirh takah pawh hmanrua chu a kal nghet thei tih a tichiang a ni.

Aerospace atanga lo chhuak a ni

Aerospace hmanrua- boruak khirh tak takah hnathawk turin siam a ni a, chu chu temperature sang leh hniam lutuk, radiation chak tak, leh light weight requirement khauh tak a ni. Satellite leh spacecraft-a electronic component, communication module leh heat dissipation system atan kan hmang thin. Light weight leh ultra-thin design mamawh a phuhruk mai bakah, a thermal conductivity ropui tak leh chemical stability chu temperature sang takah pawh a vawng reng a, chuvangin aerospace hmanrua te chu rintlak takin an kal thei a ni.

High-end Field dangte pawh a awm

Damdawi hmanrua-precision diagnostic instrument leh portable medical terminal ang chi thil siamna atan pawh hman theih a ni{1}}heat dissipation tha tak hmangin hmanrua te chu a dik taka a thawh theih nan a hmang thei bawk. Industrial automation hmanrua, sensor leh controller ang chi tan pawh a tha hle a, industrial environment buaithlak takah thermal management mamawhna a phuhruk thei bawk. Chu bakah chuan laser hmanrua leh high-power LED lamp atan hman a ni a, high-power equipment-a heat dissipation problems te chu a chinfel sak a, hmanrua te chu rei zawk a daih thei bawk.

Multi-Layer Graphite Film Manufacturer