Electric hmanga kal theihna Graphite Sheet

Electrically Conductive Graphite Sheet hi high-performance functional material a ni a, conductivity tha tak leh flexible adaptation te a thlunzawm a ni. Raw material atan high-purity natural/artificial graphite atanga siam a ni a, high-temperature rolling, graphitization, leh precision cutting process hmanga siam a ni. A hlutna bulpui ber chu traditional rigid conductive materials (copper foil leh aluminum foil ang chi) - hmun mumal lo taka innghah harsatna, a chhe awlsamna, leh thil rit lo tak takah a rit lutuk te pain point chinfelnaah a awm a ni. Narrow, curved, emaw dynamic application scenario-ah stable current transmission leh auxiliary heat dissipation a ti thei a, tunlai electronics leh energy field thara high-reliability electrical connection siamna atana key supporting material atan a thawk bawk.

Note: Product hian customization a support a

1. Conductivity tha tak a ni

Volume resistivity chu 10-50 μΩ·cm (25℃leh 5 MPa pressure-a test a ni) a ni a, a conductivity chu copper foil (1.72 μΩ·cm) 80% vel a ni a, chutih rualin metal material-a awlsam taka oxidation leh corrosion chungchanga buaina awmte erawh a pumpelh thung. In-plane current distribution uniformity chu 95% aia tam emaw, a tlukpui emaw a ni a, hei hian local current concentration chu a ti tlem thei hle a, component burnout pawh a veng thei bawk.

2. Flexibility leh Conformability tha tak a ni

Sheet thickness 0.2 mm aia tlem emaw, a tlukpui emaw tan chuan bending radius tlem ber chu 5-10 mm a tling thei a, bending nawn leh chuan cracking emaw conductivity degradation emaw a thlen lo vang. A hmun dik lo (cell edge leh chip packaging structure ang chi)-ah nghet takin a innghat thei a, micro-gap (<=0.1 mm) a luah khat thei a, vibrating environment-ah pawh electrical contact chhunzawm zel a tichiang thei bawk.

3.Conduction & Heat Dissipation te hi Dual Function a ni

Electric a conduct lai hian in-plane thermal conductivity 150-400 W/(m·K) a nei a, hei hian electronic component (chip leh battery ang chi) atanga heat siam chhuah chu heat dissipation parts-ah synchronous-in a transfer thei a ni. Single-function conductive material nena khaikhin chuan device chhunga material layer awm zat chu 30% aia tam a tihtlem thei a, internal space a humhim thei a ni.

4. Environment-a Insiamrem theihna chak tak

Hnathawh temperature range chu -60~200℃, a la awm reng thei a, chu chu high-temperature sang, low- temperature, emaw humid environment-ah (30%-95% relative humidity at 40 degree) stable conductivity (resistivity change<=10%) a la vawng reng thei a ni. Acid leh alkalis chak lo (pH 4-9) lakah a do thei a, electronic packaging material hman tlanglawn (epoxy resin leh silicone ang chi) nen pawh a inrem lo.

5. Environment friendly & Process awlsam tak a ni

Conductive graphite sheet hi high-purity graphite hmanga siam niin, a thianghlimna chu 99.9% aia tam a ni a, heavy metals lead, mercury, cadmium, etc. te tel lo, RoHS 2.0 leh REACH environmental standards zawm a ni. Laser cutting leh stamping process hmangin sheet, strip, die cut parts, etc. ang chi hrang hrangah siam theih a ni a, processing accuracy ± 0.05 mm a ni.

1. ‘Flesible connections’-a rintlakna pain point-te ngaihtuah.

• Pain point: Traditional metal foil (copper foil ang chi) te hi fatigue fracture leh conductivity failure a awm fo thin a, chu chu bending nawn leh ngai hmunah te, folding screen hinge leh FPC wiring te a ni a Conductive adhesive hian tar chakna a thlen thei.
• Solution: Graphite natural flexibility hmang hian bend sang tam tak a tuar thei a, crack lovin a tuar thei a, "hard materials breaking in dynamic structures" tih buaina chu a chinfel sak thei a ni.

2."Space Limits" hnuaia Electromagnetic Shielding (EMI) chungchang sawina.

• Pain points: 5G phone leh wearable devices interior space hi a hlu hle a, traditional metal shield (Metal Can) te hi a thuk lutuk a, curved surface emaw narrow gap emaw ah full coverage neih a harsa hle.
• Solution: A tawp berah chuan 0.03-0.1mm thickness a nih chuan chip emaw module emaw chunglam a innghat turin shielding layer atan hman theih a ni a, conductivity sang tak (surface resistance) hmangin electromagnetic interference chu tha takin a absorb thei bawk<1 Ω/□), solving the contradiction of "both shielding and lightweight".

3. "Static accumulation" leh grounding tha lo chu chinfel rawh

• Pain points: LCD/OLED screen leh touch screen-ah te hian a sir lamah static electricity (ESD) a pung nasa hle a, hei hian ground tha lo a nih chuan driver IC a ti chhe thei a traditional metal spring contact-ah hian contact area tlem a awm a, oxidation a awm duh hle a, chu chuan impedance a tipung a ni.
• Solution: Resistivity hniam leh nghet tak nei uniform grounding path hmun zau tak siam la, chu chuan static electricity chu rang takin a discharge thei a, "unreliable point contact" buaina chu a chinfel thei bawk.

4. "Heat dissipation leh conductivity" tih integration mamawhna ngaihtuah.

• Pain point: Power device thenkhat (power amplifier ang chi) hian heat dissipation leh conductivity a mamawh vek a. Thermal conductivity atana metal sheet hman hi a rit a, insulated thermal conductive sheet hman erawh chuan electric a conduct thei lo thung.
• Hrehawmna chinfel dan: Thil pakhat hman pahnih. In-plane heat spreading tha tak a pek rualin conductivity sang tak a vawng reng a, "metal heat sink+conductive adhesive" complex stacking structure chu a thlak a, BOM cost leh assembly harsatna a tihziaawm bawk.

5. Chemical corrosion awmna hmuna conductive sealing chungchang ngaihtuah

• Pain point: Fuel cell bipolar plate leh chemical sensor te hian acidic/alkaline environment-ah metal current collector te chu a tichhe nasa hle a, chu chuan contact resistance a tisang hle.
• Solution: Graphite chemical inertness hian corrosive media-ah conductivity a vawng reng a, chu chuan metal material-a "electrochemical corrosion failure" buaina chu a chinfel sak a ni.

• Company hian ISO9001 quality management system leh ISO14001 environmental management system certification a pass a, quality control leh environment friendly production lama a hmalakna ropui tak a lantir a ni. Graphite material buatsaih dan leh product performance optimization te ang chi patented technology 9 kan nei a, hei hian company product inelna kawngah nasa takin a pui a ni.

Manufacturer chauh ni lovin, overall solution pe tu kan ni a, traditional industry mizia atanga design optimizing hmanga industrial production tha famkim kan neih theih nan kan hmang bawk.

• Service Guarantee a awm bawk

1. Process control: Rolling accuracy ± 0.01mm, cutting error 0.5mm aia tlem emaw a tlukpui emaw, product dimensional accuracy sang tak a nih theih nan. Production hmanraw changkang tak tak leh automation control system hmangin production proces dik taka control theih a ni

2. Exception management: Quality chungchanga harsatna awmte rang taka chhanna tur leh a hun taka siamthatna tur darkar 4 chhunga Root Cause Analysis (RCA) mechanism siam. Thil awmdan pangngai lote chu chipchiar takin ziak la, zir chian la, zir chhuahte chu khaikhawm la, chutiang harsatna chu a lo thleng leh tawh loh nan veng rawh.

3. Hmasawnna chhunzawm zel: Kum khat chhunga customer complaint rate chu 0.3% aia tlem a ni. Customer feedback hmangin product quality leh service level kan tichangtlung zel a, quality tihchangtlunna hna kan thawk fo a, production process kan ti tha a, product performance leh quality stability kan ti sang zel bawk.

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