Thermally conductive Graphite Film hmanga siam a ni

• Thermally Conductive Graphite Film hi cutting-edge high-efficiency thermal management material a ni a, highly oriented graphite atanga high-temperature graphitization process hmanga tihthianghlim a ni. A hnathawh bulpui ber chu electronic devices atanga localized heat lo chhuak chu rang taka absorb a, in-plane direction-ah a ruala conduct leh diffuse a, "hotspot elimination" leh temperature equalization a neih theih nan a ni.
• A rit lo leh a flexible property avang hian precision electronic equipment installation space inkharkhip takah chuan a fit tha hle. High-power, high-integration devices tan heat dissipation solution stable leh efficient tak a pe a, tunlai electronic thermal management system-a core foundational materials zinga mi a ni. Traditional thermal materials performance bottleneck te chu tichhiain, thermal conductivity, thinness, leh processability te chu three{4}}dimensional balance a nei a, scenario hrang hranga thermal dissipation mamawh khauh tak chu a phuhruk a ni.

Note: Product hian customization a support a

    1.Ultra-Bidirectional Thermal Conductivity sang tak a ni: Low-defect, lian-grain highly oriented graphite structure neiin, in-plane thermal conductivity 1000 thleng a nei thei a ni1800 W/m·K, high-end model thenkhatah chuan a tam zawk14.2 W/m·K-plane kaltlangin. A in-plane thermal efficiency hi traditional metal materials copper leh aluminum aiin a let 2-5 in a sang zawk a ni. Concentrated localized heat chu rang takin a kalpui a, hei hian equipment hotspot temperature a tihhniam thei hle. Condition inang hnuaia graphene oxide-derived graphite film nena khaikhin chuan in-plane thermal conductivity 17% leh through{11}}plane thermal conductivity 118% in a ti tha a, carbon-based thin films through{12}}plane thermal conductivity bottleneck chu a solve a ni.

    2.A rit lo, a inthlak danglam thei a, a process awlsam bawk: A thickness chu a inkar ah flexible takin control theih a ni0.012-1.0 mm inkar a ni(standard size: 0.02-0.1 mm), a density chauh a ni1.4-1.9 g/cm3 vel a ni. Copper aiin 80% zetin a rit zawk a, a lian leh te inang aluminium aiin 30% in a rit zawk bawk. A nem a, a flexible bawk a, a ben (vawi 20,000 aia tam fold) theih a ni a, curved surface, gap leh complex structure dangteah pawh a fit nghet hle. Die-cutting, stamping, lamination, leh thil dang hmangin eng ang chiah pawha siam theih a ni a, a sir lamah powder tla lovin hmanrua hrang hrang structural design-ah a inmil thei a ni. Processing awlsam tak leh cost control theihna a siam bawk.

    3.Environmental Adaptability tha tak a ni: Temperature range zau takah stably taka hnathawh-40℃atanga 500℃thleng a ni, temperature sang leh hniam lama a do theihna sang zawk a lantir a, volatilization a nei lo va, rim a nei lo va, tar a nei lo bawk. Electrical insulation tha tak a nei a, flame retardancy (UL94 V0 grade), leh shock resistance a nei bawk. Model thenkhatah chuan EMI shielding functionality a awm bawk a, electronic component sensitive tak takte chu electromagnetic interference laka a humhim a, hnathawhna hmun harsa takah pawh a insiamrem thei bawk.

    4.Crystallinity sang tak leh Stability sang tak nei: Aramid film emaw polyimide ang chi precursor quality sang tak tak hmangin, lattice chhiatna te chu mahni insiamthat turin 3000℃ah high-temperature graphitization a paltlang thin. Defect index ID/IG hniam tak, 1000 thleng a nei thei0.008, in-plane grain size chu 1000 thleng a ni2179 nanometer a ni, out-of{1}}plane order stack size of53 nanometer a ni, leh turbostratic stack ratio chauh a ni1.6%, graphite AB stack structure tha ber hnaih ber a ni. Hei hian thermal conductivity nghet tak a siam a, hun rei tak-a hman laiin attenuation a awm lo va, heat dissipation efficiency nghet leh rintlak tak a neih theih nan thermal resistance hniam tak a siam bawk.

    5.Eco-friendly leh Install awlsam tak leh Wide Compatibility nei: RoHS environmental standards zawm leh thil tha lo awm lo, electronic device hrang hrangah him takin hman theih a ni. Lamination emaw adhesive coating hmanga thlawp a ni (insulation tihchak nan polyester film-ah emaw, pressure{1}}sensitive adhesive-ah pawh a inzawm rang thei a, rang taka pasting atan a hmang thei bawk), installation awlsam tak a nei bawk. Heat source surface-ah direct-a inzawm, complex additional process awm lovin, metal, plastic, foam leh thil dang nena inzawmkhawmin a performance a tichangtlung lehzual thei a ni. Traditional thermal interface materials, thermal grease leh phase change materials te chu a thlak thei a, fan leh heat pipe mamawhna pawh a ti tlem thei hle.

 

Product hman dan tur

 

Thermally Conductive Graphite Film hi a thermal conductivity sang tak, a rit lo leh a flexibility avang hian thermal management mamawhna scenario hrang hrangah hman a ni nasa hle a, a bik takin high-integration, small-size, leh high-power electronic device-ah te hman a ni. A hmanna bikte chu hetiang hi a ni:

 

1. Consumer Electronics hmanga thil siam chhuah

Electronic device portable smartphone, tablet, laptop, smartwatch, bracelet, earphone, leh game console te tan a tha hle. A bik takin core heat-generating components CPU, GPU, battery, screen driver chip, leh image sensor-ah te a inzawm a, hei hian heat a ti bo rang a, device surface temperature a tihhniam bakah, performance lag, degradation, leh battery aging lutuk avanga battery aging a veng thei bawk. Entirnan, smartphone chip thermal dissipation test-ah chuan he thil hmangtu hmanrua hian chip chunglam temperature sang ber chu 52℃atanga 45℃ah a tihhniam a, hei hian user experience leh device dam chhung a ti tha zawk a ni.

 

2. Industrial Electronics leh Semiconductor hmanga siam a ni

5G base station, server, router, switch, semiconductor siamna hmanrua (sputtering, dry etching, stepper lithography machine), power semiconductor, frequency converter, inverter, leh device dang dangah te hman a ni. High-power component-te thermal dissipation mamawhna a ngaihtuah a, hun rei tak-a hmanrua te chu a nghet taka kalpui a nih theih nan a pui a ni. A bik takin, heat flux densities thlengin a handle tha hle2000 W/cm2 a nihigh-power chips tan chuan, temperature equalization chak tak atan surface temperature danglamna 50℃atanga 9℃thlenga tihhniam a ni. 5G chip leh power semiconductor ang chi high-power electronic devices te thermal management atan support pawimawh tak a pe a ni.

 

3. Automotive Electronics hmanga thil siam chhuah

Energy thar lirthei component hrang hrangah hman a ni a, battery pack, motor controller, lirthei kal dan tur system, on-board charger, leh autonomous driving module te pawh a tel. Automotive environment sang-temperature leh vibration-intensive-ah chuan component hnathawh avanga lumna lo chhuak chu \\ha takin a ti bo a, battery lum lutuk leh circuit aging a veng a, automotive electronic system-te stability leh himna a tipung a, automotive electronics-a operational requirement khauh tak takte chu a phuhruk a ni.

 

4. Hmanraw sang -end & Specialized Fields te

Aerospace hmanrua, damdawi hmanrua, LED lighting (light bar, PCB light board), unmanned aerial vehicle (UAV), precision instrument, etc.-ah hman a ni a, aerospace leh damdawi hmanruaa electronic component leh sensor sensitive tak takte tan chuan a EMI shielding leh efficient thermal dissipation hian boruak khirh takah pawh a thawk nghet thei a ni. LED lighting-ah chuan uniform thermal dissipation hian lamp dam chhung a ti rei a, light efficiency a vawng reng bawk.

• Eng customer pain point nge ngaihtuah a nih?

Thermally Conductive Graphite Film hian power density sang leh thinning trend hnuaia electronic device-te siam chhuah rintlak lohna, heat accumulation, local hotspots, hmun tlem, leh rintlak lohna tihhniamna core pain point pali te chu a solve ber a ni.

1.Consumer electronics: "kut lum" leh "frequency reduction" tih harsatna sutkian nan.

In-plane thermal conductivity sang (300-1500 W/m · K) hian hot spot (CPU/GPU) atanga lumna chu plane lam hawiin a thehdarh nghal thei a, back shell emaw middle frame zawng zawngah a diffuse thei a, hei hian frequency tihtlem leh local high temperature avanga hot grip a awm loh nan a pui thei a ni.

2.Ultra thin/flexible devices: "space limit" leh "bending failure" natna point te chinfelna.

Thermally Conductive Graphite Film hi a thim hle a, a rit lo hle bawk: a thuk zawng chu 0.01-0.1mm a ni a, hmun a luah lo tluk a ni a, battery, screen back emaw antenna bracket-ah te pawh a inbun theih bawk.

Thermally Conductive Graphite Film hi a flexible a, bending pawh a do thei bawk: Natural graphite film (expanded graphite based) emaw synthetic graphite film (PGS) emaw hian flexibility tha tak a nei a, fold sang tam tak (formula leh carrier a zirin) a tuar thei bawk.

3.High power/high-density scenarios: "thermal coupling" leh "life decay" natna point te ngaihtuah.

Thermally Conductive Graphite Film hi temperature equalization tha tak a ni: A in-plane thermal conductivity sang tak tak hmangin "thermal expander" angin a thawk a, point heat source te chu surface heat source ah a chantir a, chu chu heat sink emaw shell emaw ah transfer in thermal resistance a tihziaawm a ni.

Thermally Conductive Graphite Film hian hnathawhna temperature a tihhniam a ni: Experimental data atanga a lan dan chuan heat source inang hnuaiah graphite film hman hian chip junction temperature chu 5-15℃in a tihhniam thei a, hei hian device dam chhung leh rintlakna nasa takin a tisang a ni.

4.Energy lirthei thar leh energy khawlkhawmna: "thermal runaway" leh "lightweighting" natna point solve.

Thermally Conductive Graphite Film hi battery cell inkara thermal balance a ni: Battery cell emaw module end plate inkarah graphite film hi dah la, a thermal conductivity sang tak hmangin battery cell inkar temperature danglamna chu flatten la, battery aging tihkhawtlai a ni.
Lightweight substitution: Thermal conductivity inang hnuaiah hian graphite film rit zawng hi copper 1/4 atanga 1/5 chauh a ni a, hei hian driving range a ti tha hle.
Insulation himna: Pure graphite film ngei pawh hi non-conductive (a nih loh leh PI film hmanga khuh insulated theih a ni), battery cell beng emaw, connecting piece emaw-ah him takin a khuh theih a, short circuit hlauhawmna a awm loh nan.

5.Optoelectronics leh Optical Equipment: "Thermal Stress Deformation"-a Pain Point chinfel dan.

Graphite film hian negative coefficient of thermal expansion (CTE) a nei a, a lum chuan a contract tlem hle. Metal emaw PCB emaw positive expansion chu a compensate thei a, thermal stress avanga warping leh displacement a tihziaawm thei a, optical system-te long-term alignment accuracy a tichiang thei bawk.
 

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