Core Product chungchang tlangpui

Heat-spreading graphite film hi thermal management material hmasawn tak a ni a, graphite crystal structure oriented sang tak chunga siam a ni. Bidirectional heat conduction technology hmangin lateral heat diffusion leh vertical heat transfer chak tak a siam a, traditional materials-a heat dissipation limitation te chu a hneh thei a ni. A core value chu ultra-high thermal conductivity ultra-thin (micrometer-level), lightweight form-a pe chhuakin flexibility vawng rengin a awm a, chu chuan complex curved surface leh confined space atan a tha hle.

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Technical parameter hrang hrang a awm bawk

A thuk zawng (mm) .	A zau zawng (mm) .	A sei zawng (m) .	Density (g/cm3) a ni.	Carbon awm zat	A rilru a buai em em a, a rilru a hah em em bawk a.
0.05	500	100	1.5–1.75	99.5–99.9	300–450
0.06	500	100	1.5–1.8	99.5–99.9	400–500
0.08	500	100	1.5–1.8	99.5–99.9	400–500
0.1	500	100	1.5–1.85	99.5–99.9	400–500
0.12	500–1000	100	1.5–1.85	99.5–99.9	400–500
0.15	500–1000	100	1.5–1.85	99.5–99.9	400–500
0.2	500–1000	100	1.5–1.85	99.5–99.9	400–500

Note: Product hian customization a support a

Hman Dan Zau Tak

Heat Spreading Graphite Film hman dan tur logic hi a chiang hle: electronic device eng pawh hmun tlemte leh heat generation sang tak nei chu a indona hmunpui ber a ni. Direct-in lumna a ti bo lo va, "heat transporter" angin a thawk a, tualchhung boruak lumna sang tak chu rang takin a thehdarh thei a ni.

1. Consumer electronics (a hmanna hmun lian ber) .

Hei hi graphite film market puitling ber a ni a, a bik takin "performance leh lightness" inkara inhnialna chinfelna a ni.

Smartphone/tablet: SoC (main chip), 5G RF chip, leh screen driver IC hnung lamah dah a ni a, game khelh emaw fast charging emaw laiin overheating leh frequency tihtlem loh nan.
Laptop/ultrabook: CPU, GPU, leh heat pipe chunglam khuh a, hei hian uniform heating a pui a, fan startup noise a ti tlem bawk.
Wearable devices (watches/VR): An ultra-thin characteristics hmanga (<0.03mm), they can dissipate heat in extremely small spaces, avoiding skin burns.

2. Inbiakpawhna leh Data Center (High Power Scenario) 1.1.

5G base station AAU (active antenna unit): 5G antenna hian power consumption sang tak a nei a, a tlangpuiin fan tel lovin sealed a ni. Graphite film hmangin power amplifier (PA) lumna chu housing-ah a hruai lut thin.
Optical module: High-speed optical communication module chhunga laser hian dense heat a siam a, graphite film hi thermal diffusion atan hman a ni.
Server motherboard: CPU leh memory module vel local equalization tih hian operational stability a ti tha zawk thin.

3. Energy thar leh Automotive Electronics (Blue Ocean lian chak ber) .

Power battery thermal management: Battery cell inkara thermal pad dah a nih angin battery pack pumpui temperature balance turin a pui a, local overheating a veng thei bawk (a hmaa i hriat tawh bipolar plate material nen a inzawm a, hei hi energy thar lirtheia graphite material hmanna lian ber dang a ni).
Car display screen/central control: brightness sang screen tan chuan temperature sang takah heat accumulation buaina a chinfel sak.
BMS (Battery Management System) main control board: main control chip chu temperature sang tak atanga a venghim a ni.

4. High end Industry leh Medical lam a ni

Medical endoscope/portable device: No-magnetic leh metal ion precipitation awm lo a nih a ngai a, graphite chemical inertness hi a thatna a ni.
Industrial laser/drone flight control: Current sang tak avanga pulse lumna (pulse heating) hmachhawn.

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Solutions Leh Customized Services pek a ni

1. "Localized high-temperature burning" (uniform heating) hlauhawmna chinfel dan tur.

Hei hi a core value ber a ni. Traditional heat sink hian heat hi a conduct rang tawk lo a, hei hian awlsam takin CPU leh 5G PA ang chi chip-ah local "hot spot" a thlen thei a ni. Hun rei tak chhunga temperature sang tak hian performance a tichhe thei a, hardware pawh a tichhia thei bawk.

Graphite solution: Utilizing its extremely high planar thermal conductivity (>1000 W/m · K), concentrated point heat source chu plane pumpuiah "flatten" nghal a ni a, 80℃hot spot chu rang takin 50℃-ah a tlahniam a, temperature danglamna a ti bo a, core components te a humhim bawk.

2. Hmun tlemtea taksa lama harsatna awmte paltlang

Mobile phone, tablet, leh drone chhungah hian heat dissipation fin dahna tur hmun a awm tawh lo tluk a, traditional metal heat dissipation fin emaw heat pipe emaw pawh dah theih a ni lo.

Graphite solution: Thin tak leh rit tak (10-100 μ m), shielding cover emaw middle frame emaw-ah lehkha ang maia inbun, Z-axis san zawng luah lo, ultra-thin device structural design nena inmil tak.

3. "Lightweight" leh "noise free" heat dissipation hriatchhuah

Aerospace, automotive electronics, emaw laptop sang-end-ah chuan rit leh ri hi hard indicator a ni. Fans emaw heavy metal heat sink emaw hian a rit leh power consumption a tipung thei a ni.

Graphite solution: Density copper 1/4 chauh a nih avangin a rit tihtlem theihna nasa tak a nei. Passive heat dissipation material a nih angin a ngawi reng a, a che thei lo a, hei vang hian rintlak tak a ni.

4. "Flexibility" leh "ease of processing" mamawhna nena inmil.

Tunlai circuit board layout hi a buaithlak hle a, heat dissipation path pawh bent a ngai fo thin. Metal materials hi fatigue fracture a nei awlsam a, a bending nawn fo avangin processing cost a sang hle.

Graphite solution: Flexibility tha tak a neih chuan eng ang chiah pawha siam theih (FPC form) a ni a, a pianzia ang zela inzawm theih a ni a, hei hian automate assembly a ti awlsam a, assembly harsatna pawh nasa takin a ti tlem bawk.

Company Chakna Leh Services

Company hian ISO9001 quality management system leh ISO14001 environmental management system certification a pass a, quality control leh environment friendly production lama a hmalakna ropui tak a lantir a ni. Graphite material buatsaih dan leh product performance optimization te ang chi patented technology 9 kan nei a, hei hian company product inelna kawngah nasa takin a pui a ni.

Manufacturer chauh ni lovin, overall solution pe tu kan ni a, traditional industry mizia atanga design optimizing hmanga industrial production tha famkim kan neih theih nan kan hmang bawk.

Service Guarantee a awm bawk

1. Process control: Rolling accuracy ± 0.01mm, cutting error 0.5mm aia tlem emaw a tlukpui emaw, product dimensional accuracy sang tak a nih theih nan. Production hmanraw changkang tak tak leh automation control system hmangin production proces dik taka control theih a ni

2. Exception enkawl dan: Darkar 4 chhung awh tur Root Cause Analysis (RCA) mechanism siamquality chungchangah rang taka chhanna tur leh a hun taka siamthatna tur ruahmanna siam turin.Thil awmdan pangngai lote chipchiar taka ziak leh zirchiang la, zir chhuahte khaikhawm la, lehchutiang harsatna lo thleng leh tawh lo turin venhim.

3. Hmasawnna chhunzawm zel: Kum khata customer complaint rate chu 0.3% aia tlem a ni.Customer feedback hmangin product quality leh service level kan tichangtlung zel a,quality tihchangtlunna hna thawh fo te, thil siam chhuah dan tur tihchangtlun te, .leh product performance leh quality stability tihchangtlun a ni.

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