1. Thil siam chhuahna bulpui (core Product).
High-Purity Graphite Tape hi graphite coil flexible tak a ni a, 99% high-purity expandable graphite atanga siam a ni a, binder leh corrosive impurities a awm lo. Block-shaped high-purity graphite-a thermal conductivity, electrical conductivity, leh high{4}}temperature resistance tha tak a vawng reng a, chutih rualin flexibility ropui tak, compression resilience, leh processing awlsamna a nei bawk. Surface gap mumal lo tak takte chu a luah khat thei a, thermal management interface tha tak tak leh airtight seal rintlak tak tak a siam thei bawk.
2. Technical lam thil chi hrang hrang
|
Parameter Item hrang hrang a awm |
A tlangpuiin Specification/Range a awm |
Testing Standard hrang hrangte |
|
Chemical a awm dan |
||
|
Carbon awm zat (C) 1.1. |
99.0%~99.9% aia tam emaw, a tlukpui emaw |
ASTM D5603 a ni |
|
Ash content a awm |
1000 ppm~100 ppm aia tlem emaw, a tlukpui emaw a ni |
- |
|
Sulphur awm zat (S) . |
500 ppm aia tlem emaw, a tlukpui emaw a ni |
- |
|
Taksa lam thil neih (Pysical Properties). |
||
|
Thickness a ni |
0.1 mm~3.0 mm (a duh angin a siam theih) |
ASTM F152 a ni |
|
Sakhal zawng |
1.0~1.3 g/cm3 (a inthlak theih) a ni. |
ASTM F1315 a ni |
|
Thermal Properties te chu a ni |
||
|
Hun rei tak-service temperature (thliah) . |
-200℃~450℃(oxidizing environment-ah) a ni. |
- |
|
Hun rei tak-rawngbawlna temperature (inert/vacuum) . |
3000℃thleng a ni |
- |
|
In-plane thermal conductivity (X-Y lam hawi) ah chuan . |
80~150 W/(m·K) |
ASTM E1461 a ni |
|
Mechanical lama thil awm dan |
||
|
Tensile chakna a ni |
4.0 MPa aia tam emaw, a tlukpui emaw |
ASTM D828 a ni |
|
Compression ratio a awm bawk |
15%~40% |
ASTM F36 a ni |
|
Rebound rate a ni |
15% aia tam emaw, a tlukpui emaw . |
ASTM F36 a ni |
3.Main Features leh Advantages te
Thermal conductivity sang tak leh thermal stability sang tak a nei bawk
Plane lam hawia thermal conductivity tha tak (150 W/(m·K) aia tam) a nei a, local overheating ven nan heat diffusion rang leh uniform tak a siam thei.
Inert gas emaw vacuum environment (non-oxidizing environment)-ah -200℃atanga 3000℃thlenga rei tak stab takin hna a thawk thei a, thermal expansion coefficient hniam tak tak leh dimensional stability tha tak a nei bawk.
Flexibility leh compensation tha tak a ni
Soft texture, bend leh wrap awlsam, complex curve hrang hrang leh uneven surface-ah pawh a fit tha hle.
Compression resilience tha tak a nei a, chu chuan contact surface-a thermal expansion, contraction, emaw machining tolerances avanga gap awmte chu a compensate thei a, long-term stable contact pressure a vawng reng thei bawk.
Thianghlimna sang tak leh chemical inertness nei tha tak a ni
Ash content hniam lutuk (100ppm aia tlem pawh a ni thei), chlorine leh sulfur ang chi corrosive ion awm lo, electronic component sensitive (eg, semiconductor equipment) emaw metal chamber emaw-ah corrosion emaw pollution emaw a thlen lo vang.
Process leh hman awlsam
A tul angin awlsam takin kut emaw hmanrua emaw hmanga tan leh stamp theih a ni.
A tlangpuiin adhesive backing nen a rawn thleng emaw, high-temperature adhesive nen pawh hman theih a ni a, installation a ti awlsam a, production efficiency a ti sang bawk.
Airtightness tha tak a ni
Compression force tling tak hnuaiah chuan gas leh liquid leakage ven nan sealing barrier tha tak a siam thei a ni.
4. Hmanna hmun tlangpui
Vacuum furnace leh temperature sang -temperature furnace te pawh a awm bawk: High-Purity Graphite Tape hi furnace kawngkhar, observation window, electrode outlet, etc.-a dynamic emaw static high-temperature sealing atan hman a ni.
Semiconductor siamna hmanrua te: CVD, PECVD, diffusion furnace, leh hmanraw dangte flange sealing leh insulation material atan hman a ni.
Fuel cell hmanga siam a ni: Graphite bipolar plate emaw metal bipolar plate emaw inkara gas sealing gasket atan hman thin.
Electronic leh electric hmanga lumna tihbo: Power device (eg, IGBT, CPU) leh heat sink inkarah thermal pad tha tak angin paste a ni.
Photovoltaic leh crystal atanga lo thang lian: Monocrystalline silicon drawing furnace leh polycrystalline silicon ingot furnace-a thermal field sealing leh insulation atan hman a ni.
Aerospace leh scientific lama zirchianna: Extreme environment hrang hrang, vacuum, high pressure, leh temperature sang takah sealing leh thermal conductivity atan hman a ni.
hot tags .: high-purity graphite tape, China high-purity graphite tape siamtute an ni
