Graphite Micro powder hmanga siam a ni

1. Product Core a ni

Graphite Micro powder hi ultrafine graphite powder material a ni a, high-purity natural graphite emaw artificial graphite atanga siam niin, crushing, grading, leh purification ang chi precision process hmanga siam a ni. A core value chu micro particle size optimization hmanga graphite layered crystal structure thatna tihpunnaah a awm a, hei hian conductivity tha tak, lubricity, high temperature resistance, leh chemical stability te a thlunzawm a, high-end industrial field-a powder materials "refinement leh functionalization" mamawhna chu a phuhruk thei a ni.

2. Technical Parameter pawimawh tak tak te

3.Product-a thil langsar ber ber (Core Features) te

(1) Ultra-fine Particle Size leh Insem dan inang tlang

Average particle size (D50) chu 1-10 μm chhungah control theih a ni (100nm-5 μm ultrafine specification-a customizable), particle size distribution span te tak te (Span<=0.8), agglomeration phenomenon awm lo, matrix-a uniform taka theh darh awlsam, end product performance mumal tak a tichiang a ni.

(2) Thianghlimna sang leh bawlhhlawh hniam

Graphite Micro powder hian fixed carbon content 99.5% aia tam emaw a tlukpui emaw a nei a (high-end specification-ah chuan fixed carbon content>=99.95% a nei a, ash content chu 0.5% aia tlem emaw a tlukpui emaw a nei bawk (ultrafine specification-ah chuan ash content 0.1% aia tlem emaw a inang emaw a awm bawk). Sulfur leh phosphorus ang chi bawlhhlawh hlauhawm tak tak a awm lo a, chutiang chuan application scenario-a bawlhhlawh paih emaw, performance tihbuai emaw a awm loh nan.

(3) Physical leh Chemical Properties tha tak a nei

Conductivity: Volume resistivity 10 Ω·cm aia tlem emaw, a tlukpui emaw, material conductivity tihsan nan conductive filler atan hman theih a ni a;

Lubrication: Mohs hardness 1-2, friction coefficient 0.15 aia tlem emaw, a tlukpui emaw chuan oil tel lo lubrication scenario-ah metal lubricant a thlak thei a;

Temperature sang tak resistance: Inert gas-ah 3000℃aia sang temperature a tuar thei a, a melt emaw oxidize emaw lo va, thermal expansion coefficient hniam (2-5 × 10−6/℃) a nei bawk

Chemical stability: Acid, alkali, leh organic solvent corrosion laka a do thei a, pH 2-12 environment-ah a stable a, chemical substance tam zawk nen a inrem lo.

(4) Processing lama inthlak danglamna tha tak

Powder hian flowability tha tak (angle of repose<=35℃) a nei a, substrate resin, rubber, metal powder, etc. nena inhmeh a awlsam a, substrate original structure a tichhe lo. Compression molding, injection molding, leh coating ang chi process hrang hrang hmangin a process theih a ni.

 

 

4. Dilna hmunpui ber

(1) Lubrication Industry lam a ni

Dry lubricant angin mechanical components, bearing, gear, valve-ah te dah belh a ni a;

Solid lubricating coatings siam tur (eg, thli hmanga power siamna hmanrua, aerospace components atana lubrication);

Lubrication dam chhung leh hnathawhna hmuna insiamrem theihna turin lubricating oil/grease additive atan hman a ni.

(2) Energy Sector thar

Lithium battery negative electrode conductive agent: Negative electrode materials (eg, graphite, silicon-based materials) conductivity a ti tha a, battery chhunga resistance a ti tlem a, charge-discharge efficiency leh cycle life a ti sang a

Fuel cell bipolar plate coating: Bipolar plate-a conductivity leh corrosion resistance a tichak a, contact resistance a ti tlem bawk.

(3) Coatings leh Ink Industry te a ni

Conductive coatings: Anti-static flooring, electromagnetic shielding coatings, electronic component shell coatings atan hman a ni a;

High temperature resistant coating: Boiler leh kiln chhung lam bang coating atan hman a ni a, hei hian temperature sang tak laka invenna leh wear resistance a tichak a;

Special ink: Ink print hnua conductivity nghet tak neih theih nan conductive ink (eg, flexible electronic circuit, RFID tag) a buatsaih thin.

(4) Metallurgy leh Refractory Material hmanga thil siam

Metallurgical protective slag: Casting chhunzawm zel laiin liquid slag film a siam a, boruak a isolate a, billet chu a lubricate a, a chunglam chhiatna a ti tlem bawk

Refractory bricks/refractory coatings: Refractory materials te temperature sang leh thermal shock resistance a ti tha a, hei hi high{0}}temperature equipment, steel leh glass kiln-ah te hman thin a ni.

(5) Electronics leh Precision lama thil siam chhuah

Electronic packaging materials: Chip heat dissipation efficiency tihsan nan epoxy resin packaging agents-ah thermal/conductive filler atan dah a ni a;

Precision polishing: Semiconductor silicon wafer leh optical glass te fine polishing atan hman a ni a, surface roughness (Ra<=0.01 μm thleng) tihtlem nan hman a ni.

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