1. Product Core a ni
High-Purity Ultra-Thin Graphite Paper hi high-performance flexible graphite product a ni a, high{3}}purity natural flake graphite atanga siam niin, advanced rolling, calendering leh purification process hmanga siam a ni. A core value chu ultra-thin thickness, high purity leh physical leh chemical property tha tak tak te inzawmkhawmnaah a awm a, hei hian industry hrang hrangin high-precision, high-reliability application mamawh a phuhruk thei a, high-end equipment leh precision components te tan thermal conductivity, electrical conductivity leh sealing solutions tha tak a pe thei a ni.
2. Technical Parameter hrang hrang te
|
Technical Indicators te pawh a awm bawk |
Hlawm khat |
Ordinary Level a ni |
High-End Level a ni |
|
Carbon awm zat tur (fixed Carbon) a awm |
% |
99.0 aia tam emaw, a tlukpui emaw |
99.5 aia lian emaw, a tlukpui emaw |
|
Ash Content a awm |
% |
0.3 aia tlem emaw, a tlukpui emaw |
0.1 aia tlem emaw, a tlukpui emaw a ni |
|
Thickness a ni |
mm |
0.01-0.10 |
0.01-0.05 |
|
Vang |
mm |
50-500 |
50-800 |
|
Sakhal zawng |
g/cm3 a ni |
0.9-1.2 |
1.0-1.3 |
|
A rilru a buai em em a, a rilru a hah em em bawk a. 20℃) . |
W/(m·K) |
300-400 |
400-500 |
|
Temperature laka inven theihna |
degree |
-200 atanga +450 thleng. |
-200 atanga +500 thleng. |
|
Tensile chakna a nei |
MPa |
2.5 aia lian emaw, a tlukpui emaw |
3.5 aia lian emaw, a tlukpui emaw |
|
Compression Rate a ni |
% |
30 aia tam emaw, a tlukpui emaw |
35 aia lian emaw, a tlukpui emaw |
|
Recovery Rate a ni |
% |
12 aia lian emaw, a tlukpui emaw |
15 aia lian emaw, a tlukpui emaw |
|
Sulphur awm zat |
% |
0.05 aia tlem emaw, a tlukpui emaw a ni |
0.03 aia tlem emaw, a tlukpui emaw a ni |
3.Product Features te a awm
Exceptional Thianghlimna sang tak: Fixed carbon content hi 99% leh a chunglam thlengin a sang a, ash, sulfur, phosphorus leh bawlhhlawh dangte a tlem hle a, applied equipment leh medium-ah bawlhhlawh a awm lo va, high-end precision scenario nen pawh a inmil hle bawk.
Ultra-Thin & Flexible tak a ni:A thickness hi 0.01mm vel a thim thei a, flexibility leh ductility tha tak a nei a, cut, bend leh laminate awlsam tak, irregular components chunglam chu base material tichhe lovin a fit tha thei hle.
Thermal Conductivity tha tak a nei a:Thermal conductivity hi 300-500 W/(m·K) thleng a ni a, hei hian rang takin heat a transfer thei a, precision components-a heat accumulation problem chu tha takin a chinfel thei a, hmanrua service life pawh a ti tha thei bawk.
Temperature sang & hniam laka invenna ropui tak:-200℃atanga +450℃(oxidizing atmosphere) inkar temperature range-ah stable performance a vawng thei a, deformation a nei lo va, decomposition a nei lo va, hnathawhna hmun harsa tak tak, temperature sang leh temperature hniam takah pawh a insiamrem thei bawk.
Chemical Inertness chak tak: 1.1.Acid, alkalis, oil leh organic solvent tam zawkin an tihchhiat theih loh bakah medium nen an inrem lo va, corrosive environment-a sealing leh isolation atan a tha hle.
Non-Asbestos & Environment humhalhna:Asbestos emaw thil hlauhawm emaw tel lovin natural graphite hmanga siam a ni a, international environment humhalhna tehfung nena inmil a ni a, hun rei tak- hman atan a him bawk.
Creep hniam & Compressibility tha tak:Creep relaxation rate hniam tak a nei a, compression rebound performance tha tak a nei a, hun rei tak-term pressure hnuaiah pawh stable performance a vawng reng thei bawk.
4. Product hman dan tur
Electronic & Semiconductor Industry hmanga siam chhuah te chu a hnuaia mi ang hian a ni.High-Purity Ultra-Thin Graphite Paper hi heat dissipation gasket atan hman a ni a, chip, LED leh integrated circuit (IC) tan thermal conductive sheet atan hman a ni a, printed circuit board (PCB) atan flexible conductive material atan hman a ni bawk a, hei hian heat dissipation efficiency tihchangtlunna leh electronic components te hnathawh dan nghet tak neih theihna tura puitu a ni.
Energy Industry thar siam tur chuan:Fuel cell bipolar plate, lithium battery thermal management components, leh solar cell conductive sheet-ah te hman a ni a, energy hmanrua tharte tha taka hman theihna tura pui turin thermal conductivity tha tak leh electrical conductivity tha tak a pe a ni.
Precision Machinery leh Sealing Industry te chu a hnuaia mi ang hian a ni.Precision valve, pump, heat exchanger leh reactor te tan ultra-thin sealing gasket atan hman a ni a, a bik takin gap tenau leh high{1}}precision sealing scenario atan a tha a, medium leakage a veng thei.
Aerospace & Sipai lama hmalakna hrang hrang:Aerospace hmanrua leh sipai precision instrument-te tana thermal insulation, heat conduction leh sealing component atan hman a ni a, temperature leh pressure nasa tak awmna hmunah a insiamrem thei a ni.
Damdawi hmanrua: 1.1.Precision medical instruments (medical monitor, diagnostic equipment ang chi) atana conductive leh heat{0}}dissipating component atana hman, thianghlimna sang tak leh bawlhhlawh awm lo, medical grade standards zawm.
Field dang: 1.1.Electronic thil siam, automotive precision component, etc. atana flexible conductive sheet, electromagnetic shielding material, leh thermal conductive linings atan hman a ni.
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